| We believe that maintaining our competitiveness through consistent R&D efforts is crucial in this rapidly changing environment. Hence, Memory Devices places great emphasis on research and development which the directors believed to be one of the main drivers for our future growth. |
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Our 42-strong R&D team consists of experienced professionals including software engineers, electronic engineers, industrial design engineers, mechanical engineers and PCB-layout engineers.
Our focus on the R&D, including new and innovative products and services, product modifications and enhancements as well as new production processes, enables us to undertake around 20 to 30 new design projects annually.
Our R&D division constitutes the following three departments:- |
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DRAM memory module R&D department
• Comprises five engineers and ten technicians
• Responsible for the development of products such as DRAM modules for PC, notebook and servers |
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Flash memory card R&D department
• Comprises six engineers and 11 technicians
• Responsible for the development of products such as:
• various Flash memory cards for digital still camera
• smaller size Flash memory cards for mobile phones with wireless transmission (such as RS-MMC and mini-SD Card)
• related peripherals including card readers
• special feature MP3 players |
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Specific process R&D department
• Comprises two engineers and seven technicians
• Responsible for the R&D of our mobile disk using "Chip on board" (COB) technology
• Developed a new process for the manufacture of digital storage cards such as RS-MMC and mini-SD Cards pending patent approval. |
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Current product development |
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New generation DRAM memory modules, targeting for launch in end of 2005
• DRAM memory modules for PCs running at 667Mhz and 800Mhz
• DRAM memory modules for notebooks running at 400Mhz and/or 533Mhz |
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New generation Flash memory storage products
• To meet future applications of high pixel digital still cameras with larger density and new sequential mode mobile phones which allow storage of images captured in a short time interval
• Developing new MMC Card |
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RS-MMC, mini-SD Card and UFD
• Higher densities and smaller form factor
• Achieve better performance at a lower cost |
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Adoption of lead-free process in our manufacturing operations
• To align our Group with the worldwide trend and emphasis on environmental protection.
• Expect to commence the upgrading of our manufacturing operations in second half of 2005. |
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| Past R&D achievements |
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• 2004 - BGA (Ball Grid Array) memory module for desktop PCs
• 2003 - WLCSP memory module (wafer level chip size package) for desktop PCs
• 2003 - TSOP (thin and soft outline packaging) memory module for notebook PCs
• 2003 - DRAM module for servers
• 2002 - Flash memory cards |
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