DRAM
Products
Memory Module for Desktop
I. Memory Module for Desktop
DDRII
Series
PC2-4300/DDR2-
533
DDR
Series
PC3200/DDR400
PC2700/DDR333
PC2100/DDR266
Dual Channel
Series
PC3200/DDR400
SDR
Series
PC133/100
II. TwiSTER Series
III. Speed Premium Series
Memory Module for Server
Memory Module for Notebook
Memory Module for Printer
Memory Module for Desktop
PC2100 / DDR266
Capacity
Features
Specifications
R2 modules are made with the newest 0.1-micron manufacturing process in Fine-Pitch Ball Grid Array (FBGA) chip packages technique, which provides some features, such as Faster data transmission, Lower power consumption, Higher capacity.
Capacity
PC2100 / DDR266 184 Pin DDR Unbuffered DIMM
Capacity
C
hip Configuration
ECC
Chip Type
Package
128MB
16Mx8 (x8)
non-ECC
DDR SDRAM
TSOPII
128MB
16Mx16 (x4)
non-ECC
DDR SDRAM
TSOPII
256MB
16Mx8 (x16)
non-ECC
DDR SDRAM
TSOPII
256MB
16Mx16 (x8)
non-ECC
DDR SDRAM
TSOPII
256MB
32Mx8 (x8)
non-ECC
DDR SDRAM
TSOPII
256MB
32Mx8 (x9)
ECC
DDR SDRAM
TSOPII
512MB
32Mx8 (x16)
non-ECC
DDR SDRAM
TSOPII
512MB
32Mx8 (x18)
ECC
DDR SDRAM
TSOPII
1GB
64Mx8 (x16)
non-ECC
DDR SDRAM
TSOPII
1GB
64Mx8 (x18)
ECC
DDR SDRAM
TSOPII
Features
184 edge connector pads
Clock Frequency:
133 MHz
SSTL-2 interface:
2.5 Voltage +/- 0.2 V
Package:
TSOP
Specifications
Data Transfer Rate: 266 Mhz
Double Data Rate architecture
JEDEC standard
MRS cycle with address key programs
*CAS latency: CL2, 2.5 (clock)
*Burst length: 2, 4, 8
*Burst type: Sequential & Interleave
2 variations of refresh
*Auto refresh *Self refresh
Serial Presence Detect support
2 Banks to be operated simultaneously or independently
TEL: 0769-88876239 FAX: 0769-88949222© Memory Devices Limited All Rights Reserved
