DRAM Products
      
   
Memory Module for Desktop
 

I. Memory Module for Desktop  

DDRII Series
   PC2-4300/DDR2-    533
DDR Series
   PC3200/DDR400
 PC2700/DDR333
 PC2100/DDR266
Dual Channel Series
   PC3200/DDR400
SDR Series
   PC133/100
II. TwiSTER Series  
III. Speed Premium Series  
Memory Module for Server
   
Memory Module for Notebook
   
Memory Module for Printer
  
 
    
Memory Module for Desktop
 
 

PC2700 / DDR333
Capacity Features Specifications
The DDR2 modules are made with the newest 0.1-micron manufacturing process in Fine-Pitch Ball Grid Array (FBGA) chip packages technique, which provides some features, such as Faster data transmission, Lower power consumption, Higher capacity.
 
   
Capacity

PC2700 / DDR333 184 Pin DDR Unbuffered DIMM
Capacity Chip Configuration ECC Chip Type Package
128MB 16Mx8 (x8) non-ECC DDR SDRAM TSOPII
128MB 16Mx16 (x4) non-ECC DDR SDRAM TSOPII
256MB 16Mx8 (x16) non-ECC DDR SDRAM TSOPII
256MB 16Mx16 (x8) non-ECC DDR SDRAM TSOPII
256MB 32Mx8 (x8) non-ECC DDR SDRAM TSOPII
256MB 32Mx8 (x9) ECC DDR SDRAM TSOPII
512MB 32Mx8 (x16) non-ECC DDR SDRAM TSOPII
512MB 32Mx8 (x18) ECC DDR SDRAM TSOPII
1GB 64Mx8 (x16) non-ECC DDR SDRAM TSOPII
1GB 64Mx8 (x18) ECC DDR SDRAM TSOPII

   
Features

184 edge connector pads

Clock Frequency:

 166 MHz

SSTL-2 interface:

 2.5 Voltage +/- 0.2 V

Package:

 TSOP

   
Specifications
  • Data Transfer Rate: 333 Mhz
  • Double Data Rate architecture
  • JEDEC standard
  • MRS cycle with address key programs
    *CAS latency: CL2, 2.5 (clock)
    *Burst length: 2, 4, 8
    *Burst type: Sequential & Interleave
  • 2 variations of refresh
    *Auto refresh *Self refresh
  • Serial Presence Detect support
  • 2 Banks to be operated simultaneously or independently

   

 
 
TEL: 0769-88876239 FAX: 0769-88949222© Memory Devices Limited All Rights Reserved